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Integrated Circuit (IC): NXP NTAG213
Air interface protocol: ISO 14443 A
Operation Frequency: 13.56 MHz
Memory: 144 bytes
Operating temperature: from -25°C to 70°C / from -13°F to 158°F
ESD voltage immunity: ±2 kV peak HBM
Bending diameter: > 50 mm, tension less than 10 N